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Coretech Electronics Corp.

Humanity | Environmental Protection | Energy Saving & Carbon Reduction

We dedicate our energy to researching, developing, and manufacturing the most robust and reliable passive semiconductor components, including bipolar/MOSFET and various power components.

Explore Our Products

About Coretech

As a trusted vendor of fundamental building blocks for complex electronic systems, we uphold core values of focus, innovation, integration, quality, and service.

Our Mission

At Coretech Electronics Corp. (CTE), we develop and manufacture two-triode/MOSFET wafers and apply them to passive power components under our own brand. We adhere to the philosophy of “focus, innovation, integration, quality, service” and provide complete customer support.

We offer customized design and packaging in various forms such as TO series, SMD series, Axial Lead, SOT, SOD, and DFN. Our product line includes ordinary diodes, Zener diodes, FRED fast recovery diodes, Schottky diodes, ESD, TVS, BJTs, bridge stacks, and MOSFETs.

Our key advantage lies in controlling the entire semiconductor supply chain — from chip development and wafer fabrication to in-house packaging, testing, and final product delivery. This vertical integration ensures superior quality control, faster turnaround, and competitive pricing.

Industrial Automation

Integrity

Built on trust and transparency in every relationship.

High Quality

Rigorous standards from wafer to finished product.

Competitiveness

Optimized production for cost-effective solutions.

Innovation

Continuous R&D for next-gen semiconductor tech.

Green Industry

Energy-saving, low-carbon, environmentally responsible.

2005
Founded
100+
Products
50+
Global Clients

Our Products

Comprehensive range of passive semiconductor components designed for reliability, efficiency, and performance across industries.

FABs - Small Signal MOSFET

Small Signal MOSFET

High-performance MOSFET wafers ideal for signal switching and amplification in compact electronic systems.

  • • Low gate charge
  • • Fast switching speed
  • • High reliability
Trench Schottky Barrier Diode Wafer

Trench Schottky Diodes

Advanced trench structure for reduced forward voltage and improved thermal performance.

  • • Low Vf & leakage
  • • High efficiency
  • • Ideal for power rectification
Bipolar Junction Transistor Wafer

BJT Wafers

Robust bipolar junction transistors for analog amplification and switching applications.

  • • High gain stability
  • • Wide operating range
  • • Low noise performance
Zener Diodes

Zener & Switching Diodes

Precision voltage regulation and fast switching for power management circuits.

  • • Tight voltage tolerance
  • • High surge capability
  • • SOD/SOT packaging options
Schottky Diodes Series

Low Vf Schottky Diodes

Ultra-low forward voltage drop for maximum energy efficiency in power conversion.

  • • Minimized power loss
  • • High current density
  • • AEC-Q101 qualified options
MOSFETs

Power MOSFETs

Complete lineup including Planar, Trench, SGT, and Open Junction MOSFETs for diverse power needs.

  • • High breakdown voltage
  • • Low Rds(on)
  • • TO, DFN, SMD packages
PWM IC / LDO / DC-DC

Power Management ICs

Integrated solutions including PWM controllers, LDO regulators, and DC-DC converters.

  • • High efficiency conversion
  • • Compact footprint
  • • Stable output regulation
Silicon Carbide Schottky

Silicon Carbide Schottky

Next-generation wide-bandgap technology under development for ultra-high efficiency systems.

  • • High temperature operation
  • • Low switching losses
  • • Future-ready for EV & renewable energy
ESD & TVS Diodes

ESD & TVS Protection

Robust transient voltage suppression and electrostatic discharge protection for sensitive electronics.

  • • Fast response time
  • • High surge current handling
  • • Ideal for USB, HDMI, data lines
Bridge & Rectifier Diodes

Bridge & Rectifier Diodes

General purpose, fast recovery, and high-efficiency rectifiers for AC-DC conversion.

  • • High current capability
  • • Low forward drop
  • • Available in multiple packages
Custom FAB Solutions

Custom Wafer Fabrication

Tailored wafer specifications and process development for unique customer requirements.

  • • Full process control
  • • NDA-protected designs
  • • Rapid prototyping
Packaging Services

Custom Packaging

Flexible packaging options including TO, SMD, SOT, SOD, DFN, and axial lead configurations.

  • • Multi-form factor support
  • • High-reliability sealing
  • • RoHS compliant

Customized Service

We provide complete customized services including component design and packaging tailored to your specific application needs.

End-to-End Customization

From concept to production, Coretech offers full customization of semiconductor components. Whether you need a unique wafer specification, special packaging, or a complete power solution, our engineering team works closely with you to deliver.

  • Custom wafer design and process development
  • Specialized packaging (TO, SMD, DFN, SOT, etc.)
  • Fast prototyping and sample delivery
  • Full quality control and testing

Our vertical integration allows us to control every step — from chip design to final packaging — ensuring faster delivery, better quality, and competitive pricing.

Custom Semiconductor Design

Contact Us

For inquiries, technical support, or custom solutions, reach out to our team.

Address: Room 820, 8F, Building 523, Ba Gua Ling Industrial Area, Futian District, Shenzhen, China
Phone: +86 755 22200268
Fax: +86 755 22200052
Email: sales@coretech-corp.com

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