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Precision Lapping & Grinding Technology

Advanced wafer grinding, double-side lapping, CMP polishing, and edge grinding equipment for semiconductor, optoelectronics, and high-precision industrial applications.

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About TengYu Technology

Shenzhen Tengyu Grinding Technology Co., Ltd. is located in Guangming New District, Shenzhen, China, with a registered capital of 5 million yuan and a plant area of approximately 13,000 square meters. We are a high-tech enterprise specializing in surface grinding and polishing technology.

Our company focuses on the R&D, production, and sales of high-precision flat grinding equipment, flat polishing machines, high-speed thinning equipment, 3D polishing systems, and related consumables. Our products serve industries including semiconductors, optoelectronics, ceramics, aerospace, automotive molds, LED, mobile phone accessories, and hardware components.

We proudly serve leading companies such as TF, MEEYA, Tongda Group, and Hanslaser, delivering reliable, precision-engineered solutions across China and international markets.

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Factory Exterior Testing Workshop Machining Workshop Front Desk

Our Product Range

High-precision grinding, lapping, and polishing equipment designed for semiconductor, optical, and industrial applications.

Double-Side Lapping Machine

Double-Side Lapping Machine

Grinds both sides of silicon wafers, optical glass, aluminum alloy, titanium alloy, tungsten steel, stainless steel, and bearing steel with high flatness and parallelism.

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Wafer Grinder

Semi-Automatic Wafer Grinder

Designed for wafer grinding or back-thinning of advanced materials: SiC, GaAs, Sapphire, Si, GaN, InP, and ultra-precision optical components.

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Automatic Wafer Grinder

Automatic Wafer Grinder

Used for grinding Si, Ge, GaAs, InP, SiC, GaN, ZnO, LiTaO3, quartz glass, and diamond semiconductor materials with high automation and precision.

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CMP Lapping Machine

CMP Lapping Machine

For single-sided precision grinding of sapphire substrates, epitaxial wafers, Si, ceramic wafers, quartz crystal, SiC, Ge, and other semiconductor materials.

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Edge Grinding Machine

Edge Grinding Machine

Precision edge profiling and grinding for wafers and optical components to eliminate chipping and improve structural integrity.

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Polishing Machine

CMP Polishing Machine

Used for 3–8 inch silicon wafers, sapphire substrates, tungsten carbide, ceramic parts, valves, crystal glass, and SiC wafers with nanometer-level surface finish.

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Large Polishing Machine

Large Polishing Machine

Suitable for single-sided polishing of large and small high-precision workpieces: aluminum alloy, stainless steel, tungsten steel, optical glass, light guide plates.

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Optical Thin Film Coater

Optical Thin Film Coater

Advanced coating system for optical components requiring high-reflectivity, anti-reflective, or protective thin films with precise thickness control.

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Dual Spindle Wafer Grinder

Dual Spindle Wafer Grinder

Features cast iron frame, marble platform, and sand-cast spindle support for ultra-stable grinding of third-generation semiconductors like SiC and GaN.

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Key Applications

Our equipment supports a wide range of high-precision industrial and semiconductor applications.

Quartz

Precision grinding and polishing for optical and electronic quartz components.

Sapphire

Used in substrates, LEDs, and high-durability optical windows.

Silicon (Si)

Wafer thinning, backgrinding, and polishing for IC manufacturing.

SiC & GaN

Third-gen semiconductor processing for power electronics and RF devices.

Ceramics

High-precision lapping for alumina, zirconia, and technical ceramics.

Hard Metals

Tungsten steel, bearing steel, and stainless steel surface finishing.

Optical Glass

ULE glass, crystal glass, and high-energy laser optics processing.

Valves & Seals

Precision lapping for mechanical seals and industrial valve components.

Why Choose TengYu?

  • ✓ Ultra-Precision: Achieve nanometer-level surface finish and sub-micron flatness.
  • ✓ Robust Design: Cast iron frames, marble platforms, and sand-cast supports for maximum stability.
  • ✓ Broad Compatibility: Supports Si, SiC, GaN, GaAs, Sapphire, Quartz, Ceramics, and more.
  • ✓ Global Support: Serving customers across China and international markets with responsive service.
  • ✓ Innovation-Driven: Continuous R&D in high-speed thinning, 3D polishing, and automation.
13,000+
Square Meters Factory Area
5M
Registered Capital (CNY)
100+
Equipment Units Shipped
10+
Countries Served

Frequently Asked Questions

What materials can your lapping machines process?

Our machines handle silicon, sapphire, SiC, GaN, GaAs, quartz, ceramics, stainless steel, tungsten steel, and optical glass.

Do you offer automation options?

Yes, we provide semi-automatic and fully automatic models, including dual-spindle and robotic loading systems.

What is the typical delivery time?

Standard machines ship in 4–8 weeks; custom configurations may require additional time.

Do you provide technical support and training?

Yes, we offer remote support, on-site installation, and operator training globally.

Get in Touch

Contact us for product inquiries, technical support, or custom solutions.

Contact Person: Grace

Phone: +86 13622378685

Email: Grace@lapping-machine.com

WhatsApp: +86 13622378685

Address: Building 34, Zone B, Yuanshan Industrial Zone, Xiangcheng Road, Guangming District, Shenzhen, China

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