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Precision PCB Manufacturing for Demanding Applications

Jiang Xi Long Hai Circuit Technology Company Ltd – a trusted partner in high-precision circuit board production with 0 PPM defect achievement. Serving industries from aerospace to medical devices with reliable, RoHS-compliant PCBs.

PCB Manufacturing Line PCB Testing Equipment Finished PCB Boards

Trusted PCB Manufacturing Since Inception

Jiang Xi Long Hai Circuit Technology Company Ltd is part of the same group as Sup Tech Company Limited, a professional manufacturer of high-precision circuit boards. We specialize in double-sided panels, multi-layer boards, blind/buried via boards, high-frequency PCBs, aluminum substrates, steel substrates, and more.

Our factory is located in Tongqiao Town, Zhongkai High-tech Zone, Jiangxi Province, with our head office based in Hong Kong. With strong technical capabilities, our PCBs are widely used in computers, telecommunications, power supplies, medical equipment, instrumentation, and aerospace systems.

  • 0 PPM Defect Achievement
  • RoHS & ISO Compliant
  • Global Clientele
Factory Overview

Our Core Philosophy

"In the fierce market competition, quality and reputation are the lives of enterprises. We have always emphasized quality first, reputation first, constantly improving product quality, enhancing company prestige, and offering competitive pricing to deliver truly satisfactory products and service to our customers."

— Jiang Xi Long Hai Circuit Technology Company Ltd

Our PCB Products

We manufacture a wide range of high-precision printed circuit boards tailored for industrial, medical, communication, and aerospace applications.

6-Layer Sink Au PCB

6-Layer Sink Au PCB

High-reliability multi-layer board with immersion gold finish for superior conductivity and corrosion resistance.

  • • 6-layer construction
  • • Immersion gold surface finish
  • • Ideal for communication modules
  • • RoHS compliant
6-Layer RoHS PCB

6-Layer RoHS PCB

Environmentally friendly multi-layer PCB meeting strict RoHS standards for global compliance.

  • • 6-layer design
  • • Lead-free manufacturing
  • • High thermal stability
  • • Suitable for power systems
4-Layer Digital Control PCB

4-Layer Digital Control PCB

Designed for digital signal processing and control systems with optimized signal integrity.

  • • 4-layer stack-up
  • • High-speed signal routing
  • • Used in automation systems
  • • Precision etching
4-Layer Power Supply PCB

4-Layer Power Supply PCB

Robust design for power conversion and regulation with high current-carrying capacity.

  • • 4-layer construction
  • • Thick copper options
  • • Thermal management design
  • • Used in industrial power supplies
High-Frequency PCB

High-Frequency PCB

Engineered for RF and microwave applications with low dielectric loss materials.

  • • RF/Microwave support
  • • PTFE or Rogers materials
  • • Impedance-controlled traces
  • • 5G and radar applications
Aluminum Substrate PCB

Aluminum Substrate PCB

Thermally efficient metal-core PCB ideal for LED lighting and high-power electronics.

  • • Aluminum base layer
  • • Excellent heat dissipation
  • • Used in LED drivers
  • • Long lifespan
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Steel Substrate PCB

Durable and mechanically strong PCB solution for harsh environments and industrial use.

  • • Steel core construction
  • • High mechanical strength
  • • Vibration resistant
  • • Industrial automation
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Multi-Layer Blind/Buried Via PCB

Advanced HDI technology for compact, high-density interconnects in modern electronics.

  • • Blind & buried vias
  • • High-density routing
  • • Space-saving design
  • • Consumer and medical devices
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Double-Sided PCB

Cost-effective solution for moderate complexity circuits with through-hole and SMT components.

  • • Two conductive layers
  • • Plated through holes
  • • Wide application range
  • • Fast turnaround
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Rigid-Flex PCB

Combines rigid and flexible substrates for 3D packaging and dynamic flexing applications.

  • • Rigid + flexible layers
  • • Space and weight savings
  • • High reliability
  • • Aerospace & medical use
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HDI PCB

High-Density Interconnect boards with microvias for advanced consumer and telecom devices.

  • • Microvia technology
  • • Fine pitch components
  • • Compact design
  • • 5G and IoT devices
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Impedance-Controlled PCB

Precision-controlled trace impedance for high-speed digital and RF signal integrity.

  • • Controlled impedance
  • • Signal integrity assured
  • • High-speed data lines
  • • Networking equipment

Advanced Manufacturing Capabilities

Equipped with state-of-the-art technology and rigorous testing protocols to ensure the highest quality standards.

Cutting-Edge Equipment

  • Fully Automatic Filming Machine – Ensures precise imaging and layer alignment.
  • Fully Automatic Parallel Exposure Machine – High-resolution photolithography for fine features.
  • Fully Automatic V-CUT Machine – Accurate panel depaneling with minimal stress.
  • Automated optical inspection (AOI) and X-ray systems for defect detection.

Reliability & Testing

  • Thermal cycling and shock testing
  • Solderability and peel strength tests
  • Electrical continuity and insulation resistance testing
  • 0 PPM defect achievement through rigorous QC processes

Production Capacity

6 Layers
Max Layer Count
High Frequency
RF & Microwave Support
Export to Worldwide Markets

Get in Touch

Ready to start your next project? Contact us today for a quote or technical consultation.

Contact Information

Contact: Mr. Luke

Mobile: +86 13143830502

Email: luke@sup-tech.com.hk

Address: Jiangxi Xinfeng Luyuan Avenue side plant 4

Working Time: Monday to Friday

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