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Pioneer in Fluxless Reflow Technology

SEMIgear is an established leader in the design, development, and manufacturing of fluxless reflow equipment for the semiconductor packaging industry since 2002. Acquired by PSK Holdings in 2012, we continue to innovate and deliver high-performance, low-cost-of-ownership solutions trusted worldwide.

Explore Our Products

About SEMIgear

SEMIgear has been a leader in fluxless reflow technology since 2002, delivering advanced equipment for the semiconductor packaging industry. Our mission is to provide innovative, reliable, and eco-friendly solutions that enhance manufacturing efficiency and product quality.

In 2012, SEMIgear was acquired by PSK Holdings, a global leader in semiconductor packaging. This strategic partnership enables us to combine cutting-edge R&D with extensive industry expertise, ensuring continuous innovation and support for our customers.

2002

Founded

2012

Acquired by PSK

#1

Market Share

SEMIgear Facility

Our Products

VIENNA

VIENNA

  • ✔ Low Cost of Ownership (CoO)
  • ✔ Compact footprint (550mm panel size)
  • ✔ Warpage minimization
  • ✔ Excellent temperature uniformity
  • ✔ High throughput & yield
GENEVA XP

GENEVA XP

  • ✔ Low CoO & high reliability
  • ✔ Small footprint
  • ✔ Warpage minimization
  • ✔ High productivity
  • ✔ High throughput & yield
GENEVA Series

GENEVA Series

  • ✔ No.1 worldwide market share
  • ✔ Field-proven stability & quality
  • ✔ Eco-friendly process
  • ✔ Compact footprint
  • ✔ Under development for bonding reflow
Fluxless Reflow System

Advanced Reflow System

  • ✔ Eliminates flux dispensing & cleaning
  • ✔ Reduces process steps
  • ✔ Increases throughput
  • ✔ Prevents Sn overflow on Cu sidewall
  • ✔ Ideal for FOWLP applications
Thermal Control Module

Thermal Control Module

  • ✔ Dual zone top heater
  • ✔ Individual temp control (center & edge)
  • ✔ Improves wafer temperature uniformity
  • ✔ Supports precise thermal profiles
  • ✔ Compatible with GENEVA platforms
Vacuum Chuck System

Multi Vacuum Chuck

  • ✔ Individual vacuum control (center, middle, edge)
  • ✔ Reduces warpage
  • ✔ Easy cap modification
  • ✔ No chuck replacement needed
  • ✔ Enhances process stability
Ring Clamp System

Ring Clamp System

  • ✔ Holds edge of wafer
  • ✔ Minimizes warpage during reflow
  • ✔ Improves temperature uniformity
  • ✔ Compatible with thin wafers
  • ✔ Supports high-density packaging
FOWLP Solution

FOWLP Solution

  • ✔ Optimized for Fan-Out Wafer Level Packaging
  • ✔ Eliminates flux-borne polymer damage
  • ✔ Enables small pitch interconnects
  • ✔ High yield & reliability
  • ✔ Scalable for high-volume production
Eco Process System

Eco Process System

  • ✔ Reduces chemical usage
  • ✔ No flux cleaning required
  • ✔ Lower environmental impact
  • ✔ Complies with green manufacturing standards
  • ✔ Sustainable semiconductor packaging
High-Throughput Platform

High-Throughput Platform

  • ✔ Designed for mass production
  • ✔ Fast cycle times
  • ✔ Automated loading/unloading
  • ✔ Real-time monitoring
  • ✔ Remote diagnostics support
Bonding Reflow Development

Bonding Reflow Development

  • ✔ Under active development
  • ✔ Extends GENEVA platform capabilities
  • ✔ Enables advanced packaging integration
  • ✔ High alignment precision
  • ✔ Future-ready technology
Custom Integration Solutions

Custom Integration Solutions

  • ✔ Tailored to customer needs
  • ✔ Integration with existing lines
  • ✔ Process optimization services
  • ✔ On-site engineering support
  • ✔ Global service network

Our Technology

Fluxless Reflow Advantage

SEMIgear's fluxless reflow technology eliminates the need for flux dispensing and cleaning, reducing process steps and increasing throughput.

  • Low Cost of Ownership: Fewer process steps, reduced chemical use, lower maintenance.
  • High Reliability: Prevents Sn overflow and eliminates flux-borne polymer damage.
  • Warpage Minimization: Ring clamp and multi vacuum chuck ensure flatness.
  • Small Pitches: Enables advanced packaging with fine-pitch interconnects.
Fluxless Technology

Global Networks

Xi'an

Unit 608, Block B, Greenland Center, northwest corner of intersection of Zhangba2 Road and Jinye Road, Hi-tech Zone, Xi'an, Shaanxi, China

Beijing

2804 Guorui Plaza, Building B, No.1 Ronghua South Road, Economic & Technological Development Zone, Beijing Shi, China 100176

Wuxi

Room 1106-1107, Block B, IC Design Building, No. 33-2 Xinda Road, Wangzhuang Street, Xinwu District, Wuxi City, Jiangsu Province, China

Dalian

F11-05, Jinma International Building, No.1 Yongde Street, Jinma Road, Jinzhou, Dalian Shi, Liaoning Sheng, China 116600

Chengdu

5F-523, Angus Summit Centre, 169 JinKe South Road, Jinniu District, ChengDu Shi, SiChuan Sheng, China 610037

Hefei

17F-01, Innovation Center, No.2809 Chuangxin Avenue, High-Tech Zone, Hefei Shi, Anhui Sheng, China 230088

Wuhan

Room 16, floor 5, office unit, building G-1, block G, Optics Valley Star project No. 797, Gaoxin Avenue, East Lake New Technology Development Zone, Wuhan Shi, Hubei Sheng, China 430075

Xiamen

Room E907, TaiWan Incubation Center, No.88 Xiangxing Road, Xiamen Torch (Xiang'an) Industrial Zone, Xiamen Shi, Fujian Sheng, China 361115

Quanzhou

7 Ying Bin Lu, Jinjiang Shi, Quanzhou Shi, Fujian Sheng, China 362203

PSK Korea

48, Samsung-1ro 4-gil, Hwaseong-si, Gyeonggi-do, Republic of Korea 18449

Get in Touch

For more information about our fluxless reflow solutions, please visit our official website.

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